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Tantalum Sputtering Target – Disc

ʻO ka wehewehe pōkole:

Hoʻohana nui ʻia ʻo Tantalum sputtering target i ka ʻoihana semiconductor a me ka ʻoihana uhi optical.Hana mākou i nā ʻano kikoʻī like ʻole o ka tantalum sputtering targets ma ke noi ʻana o nā mea kūʻai mai ka ʻoihana semiconductor a me ka ʻoihana optical ma o ka hoʻoheheʻe ʻana i ka umu EB.Ma muli o ka makaʻala i ke kaʻina hana ʻōwili kū hoʻokahi, ma o ka mālama paʻakikī a me ka mahana annealing pololei a me ka manawa, hana mākou i nā ʻano like ʻole o nā pahuhopu tantalum sputtering e like me nā pahuhopu disc, nā pahuhopu rectangular a me nā pahuhopu rotary.Eia kekahi, ke hōʻoiaʻiʻo nei mākou i ka maʻemaʻe tantalum ma waena o 99.95% a 99.99% a i ʻole;ʻo ka nui o ka palaoa ma lalo o 100um, ʻo ka pālahalaha ma lalo o 0.2mm a me ka Surface


Huahana Huahana

Huahana Huahana

wehewehe

Hoʻohana nui ʻia ʻo Tantalum sputtering target i ka ʻoihana semiconductor a me ka ʻoihana uhi optical.Hana mākou i nā ʻano kikoʻī like ʻole o ka tantalum sputtering targets ma ke noi ʻana o nā mea kūʻai mai ka ʻoihana semiconductor a me ka ʻoihana optical ma o ka hoʻoheheʻe ʻana i ka umu EB.Ma muli o ka makaʻala i ke kaʻina hana ʻōwili kū hoʻokahi, ma o ka mālama paʻakikī a me ka mahana annealing pololei a me ka manawa, hana mākou i nā ʻano like ʻole o nā pahuhopu tantalum sputtering e like me nā pahuhopu disc, nā pahuhopu rectangular a me nā pahuhopu rotary.Eia kekahi, ke hōʻoiaʻiʻo nei mākou i ka maʻemaʻe tantalum ma waena o 99.95% a 99.99% a i ʻole;ʻo ka nui o ka palaoa ma lalo o 100um, ʻo ka pālahalaha ma lalo o 0.2mm a ʻo ka Surface Roughness ma lalo o Ra.1.6μm.Hiki ke hoʻopili ʻia ka nui e nā koi o nā mea kūʻai aku.Mālama mākou i ka maikaʻi o kā mākou huahana ma o ke kumu waiwai a hiki i ka laina hana holoʻokoʻa a hāʻawi hope i kā mākou mea kūʻai aku i mea e ʻike pono ai ʻoe e kūʻai i kā mākou huahana me ka paʻa a me ka maikaʻi like i kēlā me kēia pā.

Ke ho'āʻo nei mākou i kā mākou mea maikaʻi loa e hana hou i kā mākou ʻenehana, hoʻomaikaʻi i ka maikaʻi o ka huahana, hoʻonui i ka helu hoʻohana huahana, hoʻohaʻahaʻa i nā kumukūʻai, hoʻomaikaʻi i kā mākou lawelawe e hoʻolako i kā mākou mea kūʻai aku me nā huahana ʻoi aku ka maikaʻi akā haʻahaʻa nā kumukūʻai kūʻai.Ke koho ʻoe iā mākou, e loaʻa iā ʻoe kā mākou huahana paʻa kiʻekiʻe, ʻoi aku ke kumukūʻai hoʻokūkū ma mua o nā mea hoʻolako ʻē aʻe a me kā mākou lawelawe kūpono, kiʻekiʻe.

Hoʻopuka mākou i nā pahuhopu R05200, R05400 e kū ana i ka maʻamau ASTM B708 ​​a hiki iā mākou ke hana i nā pahuhopu e like me kāu mau kiʻi i hāʻawi ʻia.Ke hoʻohana nei i kā mākou kiʻekiʻe kiʻekiʻe tantalum ingots, nā mea hana kiʻekiʻe, ka ʻenehana hou, ka hui ʻoihana, ua hana mākou i kāu mau pahuhopu sputtering e pono ai.Hiki iā ʻoe ke haʻi iā mākou i kāu mau koi āpau a hoʻolaʻa mākou i ka hana ʻana i kāu mau pono.

ʻAno a me ka nui:

ASTM B708 ​​Maʻamau Tantalum Sputtering Target , 99.95% 3N5 - 99.99% 4N Maʻemaʻe , Disc Target

Nā mea hoʻohui kemika:

Nānā Maʻamau: Ta 99.95% 3N5 - 99.99%(4N)

ʻO nā mea haumia metala, ppm max ma ke kaumaha

ʻElemu Al Au Ag Bi B Ca Cl Cd Co Cr Cu Fe
Maʻiʻo 0.2 1.0 1.0 1.0 0.1 0.1 1.0 1.0 0.05 0.25 0.75 0.4
ʻElemu Ga Ge Hf K Li Mg Na Mo Mn Nb Ni P
Maʻiʻo 1.0 1.0 1.0 0.05 0.1 0.1 0.1 5.0 0.1 75 0.25 1.0
ʻElemu Pb S Si Sn Th Ti V W Zn Zr Y U
Maʻiʻo 1.0 0.2 0.2 0.1 0.0 1.0 0.2 70.0 1.0 0.2 1.0 0.005

ʻO nā haumia non-Metallic, ppm max ma ke kaumaha

ʻElemu N H O C
Maʻiʻo 100 15 150 100

Kaulike: Tantalum

Ka nui o ka palaoa: ka nui maʻamau<100μm ka nui o ka palaoa

Loaʻa ka nui ʻai ʻē aʻe ma ke noi

Paha: ≤0.2mm

ʻO ka ʻili o ka ʻili:< Ra 1.6μm

Ili: Pohihihi

Nā noi

ʻO nā mea uhi no nā semiconductor, optics


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