Tantalum Sputtering Target – Disc
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Hoʻohana nui ʻia ʻo Tantalum sputtering target i ka ʻoihana semiconductor a me ka ʻoihana uhi optical.Hana mākou i nā ʻano kikoʻī like ʻole o ka tantalum sputtering targets ma ke noi ʻana o nā mea kūʻai mai ka ʻoihana semiconductor a me ka ʻoihana optical ma o ka hoʻoheheʻe ʻana i ka umu EB.Ma muli o ka makaʻala i ke kaʻina hana ʻōwili kū hoʻokahi, ma o ka mālama paʻakikī a me ka mahana annealing pololei a me ka manawa, hana mākou i nā ʻano like ʻole o nā pahuhopu tantalum sputtering e like me nā pahuhopu disc, nā pahuhopu rectangular a me nā pahuhopu rotary.Eia kekahi, ke hōʻoiaʻiʻo nei mākou i ka maʻemaʻe tantalum ma waena o 99.95% a 99.99% a i ʻole;ʻo ka nui o ka palaoa ma lalo o 100um, ʻo ka pālahalaha ma lalo o 0.2mm a ʻo ka Surface Roughness ma lalo o Ra.1.6μm.Hiki ke hoʻopili ʻia ka nui e nā koi o nā mea kūʻai aku.Mālama mākou i ka maikaʻi o kā mākou huahana ma o ke kumu waiwai a hiki i ka laina hana holoʻokoʻa a hāʻawi hope i kā mākou mea kūʻai aku i mea e ʻike pono ai ʻoe e kūʻai i kā mākou huahana me ka paʻa a me ka maikaʻi like i kēlā me kēia pā.
Ke ho'āʻo nei mākou i kā mākou mea maikaʻi loa e hana hou i kā mākou ʻenehana, hoʻomaikaʻi i ka maikaʻi o ka huahana, hoʻonui i ka helu hoʻohana huahana, hoʻohaʻahaʻa i nā kumukūʻai, hoʻomaikaʻi i kā mākou lawelawe e hoʻolako i kā mākou mea kūʻai aku me nā huahana ʻoi aku ka maikaʻi akā haʻahaʻa nā kumukūʻai kūʻai.Ke koho ʻoe iā mākou, e loaʻa iā ʻoe kā mākou huahana paʻa kiʻekiʻe, ʻoi aku ke kumukūʻai hoʻokūkū ma mua o nā mea hoʻolako ʻē aʻe a me kā mākou lawelawe kūpono, kiʻekiʻe.
Hoʻopuka mākou i nā pahuhopu R05200, R05400 e kū ana i ka maʻamau ASTM B708 a hiki iā mākou ke hana i nā pahuhopu e like me kāu mau kiʻi i hāʻawi ʻia.Ke hoʻohana nei i kā mākou kiʻekiʻe kiʻekiʻe tantalum ingots, nā mea hana kiʻekiʻe, ka ʻenehana hou, ka hui ʻoihana, ua hana mākou i kāu mau pahuhopu sputtering e pono ai.Hiki iā ʻoe ke haʻi iā mākou i kāu mau koi āpau a hoʻolaʻa mākou i ka hana ʻana i kāu mau pono.
ʻAno a me ka nui:
ASTM B708 Maʻamau Tantalum Sputtering Target , 99.95% 3N5 - 99.99% 4N Maʻemaʻe , Disc Target
Nā mea hoʻohui kemika:
Nānā Maʻamau: Ta 99.95% 3N5 - 99.99%(4N)
ʻO nā mea haumia metala, ppm max ma ke kaumaha
ʻElemu | Al | Au | Ag | Bi | B | Ca | Cl | Cd | Co | Cr | Cu | Fe |
Maʻiʻo | 0.2 | 1.0 | 1.0 | 1.0 | 0.1 | 0.1 | 1.0 | 1.0 | 0.05 | 0.25 | 0.75 | 0.4 |
ʻElemu | Ga | Ge | Hf | K | Li | Mg | Na | Mo | Mn | Nb | Ni | P |
Maʻiʻo | 1.0 | 1.0 | 1.0 | 0.05 | 0.1 | 0.1 | 0.1 | 5.0 | 0.1 | 75 | 0.25 | 1.0 |
ʻElemu | Pb | S | Si | Sn | Th | Ti | V | W | Zn | Zr | Y | U |
Maʻiʻo | 1.0 | 0.2 | 0.2 | 0.1 | 0.0 | 1.0 | 0.2 | 70.0 | 1.0 | 0.2 | 1.0 | 0.005 |
ʻO nā haumia non-Metallic, ppm max ma ke kaumaha
ʻElemu | N | H | O | C |
Maʻiʻo | 100 | 15 | 150 | 100 |
Kaulike: Tantalum
Ka nui o ka palaoa: ka nui maʻamau<100μm ka nui o ka palaoa
Loaʻa ka nui ʻai ʻē aʻe ma ke noi
Paha: ≤0.2mm
ʻO ka ʻili o ka ʻili:< Ra 1.6μm
Ili: Pohihihi
Nā noi
ʻO nā mea uhi no nā semiconductor, optics